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1. general description zero dead time class-d 7.5 a power comparator the tda8939 is a power comparator designed for use in a high ef?ciency class-d audio power ampli?er system. it contains power switches, drive logic, protection circuitry, bias circuitry and a fully differential input stage (comparator). this device is optimized for applications in fully digital open-loop class-d audio systems (in combination with a digital pwm controller). the tda8939 power comparator operates with high ef?ciency and low dissipation. the system operates over a wide supply voltage range from 10 v up to 30 v. 2. features n zero dead time switching n maximum output current 7.5 a n standby mode n high ef?ciency n operating voltage from 10 v to 30 v (symmetrical) or 20 v to 60 v (asymmetrical) n low quiescent current n high output power n diagnostic output n thermal protection, current protection and voltage protection. 3. applications n television sets n home-sound sets n multimedia systems n all mains fed audio systems n car audio (boosters). tda8939 zero dead time class-d 7.5 a power comparator rev. 01 22 april 2004 objective data sheet
9397 750 13023 ? koninklijke philips electronics n.v. 2004. all rights reserved. objective data sheet rev. 01 22 april 2004 2 of 21 philips semiconductors tda8939 zero dead time class-d 7.5 a power comparator 4. quick reference data [1] when the supply voltage is below 12.5 v the pwm outputs will not be able to switch to the high side at the ?rst pwm cycle. 5. ordering information table 1: quick reference data v p = 25 v; f carrier = 384 khz. symbol parameter conditions min typ max unit v p supply voltage symmetrical supply voltage [1] 10 25 30 v asymmetrical supply voltage 20 50 60 v i q(tot) total quiescent current no load connected; no ?lters; no snubbers connected - 5070ma h ef?ciency p rated -90-% table 2: ordering information type number package name description version TDA8939TH hsop24 plastic, heatsink small outline package; 24 leads; low stand-off height sot566-3
9397 750 13023 ? koninklijke philips electronics n.v. 2004. all rights reserved. objective data sheet rev. 01 22 april 2004 3 of 21 philips semiconductors tda8939 zero dead time class-d 7.5 a power comparator 6. block diagram fig 1. block diagram. 001aaa624 zero dead time control stab 12 v protection latch q s r 3 otp ocp ovp uvp temperature sensor current protection overvoltage protection undervoltage protection driver high driver low zero dead time control stab 12 v driver high driver low v ssd heatsink n.c. sub 24 22 23 boot1 v ddp1 21 7 diagn 6 enable 8 cgnd 10 v dda2 9 in2p 12 v ssa2 11 in2n 5 powerup 1 v ssa1 2 in1n 4 in1p 3 v dda1 out1 19 stab1 20 v ssp1 15 boot2 14 v ddp2 16 out2 18 stab2 17 v ssp2 TDA8939TH 13
9397 750 13023 ? koninklijke philips electronics n.v. 2004. all rights reserved. objective data sheet rev. 01 22 april 2004 4 of 21 philips semiconductors tda8939 zero dead time class-d 7.5 a power comparator 7. pinning information 7.1 pinning 7.2 pin description fig 2. pin con?guration. tda8939 v ssd v ssa1 v ddp1 in1n boot1 v dda1 out1 in1p v ssp1 powerup stab1 enable stab2 diagn v ssp2 cgnd out2 in2p boot2 v dda2 v ddp2 in2n n.c. v ssa2 001aaa625 24 23 22 21 20 19 18 17 16 15 14 13 11 12 9 10 7 8 5 6 3 4 1 2 table 3: pin description symbol pin description v ssa1 1 negative analog supply voltage for channel 1 in1n 2 inverting input channel 1 v dda1 3 positive analog supply voltage for channel 1 in1p 4 non-inverting input channel 1 powerup 5 enable input for switching on internal reference sources enable 6 digital enable input diagn 7 digital open-drain diagnostic output for otp, ocp, ovp and uvp (active low) cgnd 8 common ground, reference ground for diagnostic, enable and power-up in2p 9 non-inverting input channel 2 v dda2 10 positive analog supply voltage for channel 2 in2n 11 inverting input channel 2 v ssa2 12 negative analog supply voltage for channel 2 n.c. 13 not connected v ddp2 14 positive power supply voltage for channel 2 boot2 15 bootstrap capacitor 2 out2 16 pwm output channel 2 v ssp2 17 negative power supply voltage for channel 2 stab2 18 decoupling internal stabilizer for logic supply channel 2
9397 750 13023 ? koninklijke philips electronics n.v. 2004. all rights reserved. objective data sheet rev. 01 22 april 2004 5 of 21 philips semiconductors tda8939 zero dead time class-d 7.5 a power comparator 8. functional description 8.1 general the tda8939 class-d power comparator is designed for use in fully digital open-loop class-d audio applications. excellent timing accuracy with respect to delay times and rise and fall times is achieved and one of the most important sources of distortion in a full digital open-loop audio ampli?er is eliminated; the zero dead time switching concept is included. the tda8939 contains two independent class-d output stages with high power d-mos switches, drivers, timing and control logic. for protection a temperature sensor, a maximum current detection and overvoltage detection circuit are integrated. an internal protection latch keeps the power comparator in shut-down mode after a fault condition has been detected. external reset of the latch is required via the enable input. 8.2 protections overtemperature, overcurrent and overvoltage sensors are included in the tda8939 power comparator. in the event that the maximum temperature, maximum current or maximum supply voltage is exceeded the diagnostic output is activated (open-drain output pulled-down via external pull-up resistor). the diagnostic output pin is activated (active low) in case of: 1. overtemperature (otp): the junction temperature (t j ) exceeds a threshold level. 2. overcurrent (ocp): the output current exceeds the maximum output current threshold level (e.g. when the loudspeaker terminals are short-circuited it will be detected by the current protection). 3. overvoltage (ovp): the supply voltage applied to the power comparator exceeds the maximum supply voltage threshold level. the tda8939 is self-protecting. if a fault condition (otp, ocp or ovp) is detected it will pull-down the diagnostic output (pin 7), while at the same time shutting down the power stage. in case of a fault condition in one of the half-bridges or output channel the other half-bridge and output channel will also shut down. all protections trigger a latch which ensures that the power stage remains deactivated until the latch is reset again. the latch is reset by switching the enable voltage of the power stage to low level. both set (s) and reset (r) inputs of the protection latch trigger on a negative falling slope. stab1 19 decoupling internal stabilizer for logic supply channel 1 v ssp1 20 negative power supply voltage for channel 1 out1 21 pwm output channel 1 boot1 22 bootstrap capacitor 1 v ddp1 23 positive power supply voltage for channel 1 v ssd 24 negative digital supply voltage sub - heat spreader of package; internally connected to v ssd table 3: pin description continued symbol pin description
9397 750 13023 ? koninklijke philips electronics n.v. 2004. all rights reserved. objective data sheet rev. 01 22 april 2004 6 of 21 philips semiconductors tda8939 zero dead time class-d 7.5 a power comparator the block diagram of diagnostic output including otp, ocp and ovp is illustrated in figure 3 . the diagnostic output (pin 7) is an open-drain output; a pull-up resistor connected to +v pull-up has to be applied externally. 8.3 interfacing between controller and the tda8939 for interfacing with a digital pwm controller ic or microcontroller in the ?nal system application the following inputs and outputs are available see t ab le 4 and 5 . 8.3.1 inputs fig 3. ocp, otp and ovp protection: s/r latch. 001aaa623 + v pull-up otp latch ocp ovp s rq enable disable power stage + v int tda8939 open-drain diagn cgnd r2 r pu c1 r1 table 4: inputs pin name pin number description in1p and in1n 4 and 2 full differential input for output channel 1; referenced with respect to each other; common mode referenced to v ssd in2p and in2n 9 and 11 full differential input for output channel 2; referenced with respect to each other; common mode referenced to v ssd powerup 5 standby switch; reference to cgnd; at a low level the device is in standby mode and consumes a very low standby current. at high level the device is dc-biased (switch-on of internal reference voltages and currents). the device can only be switched to full operating mode by the enable input, if the power-up input is at high level. enable 6 mode switch; reference to cgnd; at a low level the power d-mos switches are open and the pwm output is ?oating; all internal logic circuits are in reset condition. at a high level the power comparator is fully operational if the power-up input is also at a high level. in this condition the power comparator outputs are controlled by the input pins (in1p, in1n, in2p and in2n); see also figure 6 . the enable input signal is also used to reset the protection latch.
9397 750 13023 ? koninklijke philips electronics n.v. 2004. all rights reserved. objective data sheet rev. 01 22 april 2004 7 of 21 philips semiconductors tda8939 zero dead time class-d 7.5 a power comparator 8.3.2 outputs 8.3.3 reference voltages 8.4 start-up timing power comparator mode selection: ? standby mode: when pin powerup is low, the power comparator is in standby mode, independent of the signal on the enable input ? reset mode: when pin powerup is high, the status of the power comparator is controlled by pin enable; if pin enable is low, the status of the power stage is reset and the outputs are ?oating ? operating mode: when pin enable is high, the power stage is in operating mode. to ensure correct start-up of the power stage, the enable input should never be high when the power-up input is low. before switching to operating mode, the ampli?er should ?rst be switched to reset mode. remark: it is possible to directly connect the power-up input to the positive supply line (e.g. v dda1 ). as soon as the supply voltage is applied the device will be dc-biased (reset mode). table 5: outputs pin name pin number description diagn 7 digital open-drain output; referenced to cgnd; output indicates the following fault conditions: otp, ocp, ovp and uvp. in the event of a fault condition the output is pulled to the cgnd voltage (active low). if the diagnostic output functionality is used in the application, an external pull-up resistor is required. table 6: reference voltages pin name pin number description cgnd 8 common ground; reference ground for diagnostic output, enable input and power-up input v ssd 24 negative digital supply; reference ground digital circuits. the v ssd pin should be connected to v ss voltage in the application. internally the v ssd pin is connected to the v ssax and v sspx (e.g. v ssa1 and v ssp1 ) via an esd protection diode. table 7: mode selection pin mode powerup enable low x standby high low reset high high operating
9397 750 13023 ? koninklijke philips electronics n.v. 2004. all rights reserved. objective data sheet rev. 01 22 april 2004 8 of 21 philips semiconductors tda8939 zero dead time class-d 7.5 a power comparator 9. limiting values 10. thermal characteristics fig 4. mode selection timing diagram. 001aaa062 standby start-up sequence switch-off sequence status powerup enable reset operating reset standby table 8: limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v p supply voltage - 60 v i orm repetitive peak current on output pins - 7.5 a t stg storage temperature - 55 +150 c t amb ambient temperature - 40 +85 c t vj virtual junction temperature - 150 c table 9: thermal characteristics symbol parameter conditions value unit r th(j-a) thermal resistance from junction to ambient in free air 40 k/w r th(j-c) thermal resistance from junction to case 1.3 k/w
9397 750 13023 ? koninklijke philips electronics n.v. 2004. all rights reserved. objective data sheet rev. 01 22 april 2004 9 of 21 philips semiconductors tda8939 zero dead time class-d 7.5 a power comparator 11. static characteristics table 10: static characteristics v p = 25 v; f carrier = 384 khz; t amb = 25 c; unless otherwise speci?ed. symbol parameter conditions min typ max unit supplies v p supply voltage symmetrical supply voltage [1] 10 25 30 v asymmetrical supply voltage 20 50 60 v i q quiescent current no load; no ?lters; no snubbers connected -5070 ma reset mode - 10 20 ma i stb standby current standby mode - 120 170 m a internal stabilizer logic supplies v stab1 , v stab2 stabilizer output voltage 11 12 15 v comparator full differential input stage: pins in1p, in1n, in2p and in2n v i(diff) differential input voltage range 1 3.3 12 v v i(com) common mode input voltage v ssa1 -v dda1 - 7.5 v i i(bias) input bias current - - 10 m a common ground: pin cgnd v cgnd common ground reference voltage asymmetrical supply - 0 - v diagnostic output: pin diagn v ol low-level output voltage referenced to cgnd; i diagn = 1 ma [2] 0-1 v v pu(max) maximum pull-up voltage referenced to cgnd - - 12 v i l leakage current no error condition - - 50 m a enable input: pin enable v il low-level input voltage referenced to cgnd 0 - 1 v v ih high-level input voltage referenced to cgnd 3 - 12 v i i input current v enable = 12 v - 70 140 m a power-up input: pin powerup v il low-level input voltage referenced to cgnd 0 - 0.5 v v ih high-level input voltage referenced to cgnd 3 - v dda v v hys hysteresis voltage - 0.3 - v i i input current v powerup = 12 v - 70 140 m a
9397 750 13023 ? koninklijke philips electronics n.v. 2004. all rights reserved. objective data sheet rev. 01 22 april 2004 10 of 21 philips semiconductors tda8939 zero dead time class-d 7.5 a power comparator [1] when the supply voltage is below 12.5 v the pwm outputs will not be able to switch to the high side at the ?rst pwm cycle. [2] otp, ocp and/or ovp protection activated. 12. dynamic characteristics [1] output power measured across the loudspeaker load. power measurement based on indirect measurement by measuring the r ds_on . temperature protection t diag diagnostic trigger temperature v diagn = v ol 150 - - c overcurrent protection i prot diagnostic and protection trigger current v diagn = v ol 7.5 - - a overvoltage protection v dd(max) diagnostic and protection trigger maximum supply voltage v diagn = v ol 30 33 - v table 10: static characteristics continued v p = 25 v; f carrier = 384 khz; t amb = 25 c; unless otherwise speci?ed. symbol parameter conditions min typ max unit table 11: dynamic characteristics v p = 25 v; t amb = 25 c; f carrier = 384 khz; see also figure 8 for de?nitions. symbol parameter conditions min typ max unit pwm output t r rise time output voltage - 20 - ns t f fall time output voltage - 20 - ns t dead dead time - 0 - ns t r(lh) large signal response time low-to-high transition at output input amplitude = 3.3 v - 90 - ns t r(hl) large signal response time high-to-low transition at output input amplitude = 3.3 v - 90 - ns t w(min) minimal pulse width - 150 - ns r ds_on r ds_on output transistors - 0.2 0.3 w h ef?ciency p o = p rated [1] - - 90 -
9397 750 13023 ? koninklijke philips electronics n.v. 2004. all rights reserved. objective data sheet rev. 01 22 april 2004 11 of 21 philips semiconductors tda8939 zero dead time class-d 7.5 a power comparator v common = v ssa1 to (v dda1 - 7.5 v). t dead cannot be represented in the ?gure. response times depend on input signal amplitude. the second input pulse is not reproduced with same pulse width by the output due to minimum pulse width limitation. fig 5. timing diagram pwm output. t r(lh) 3.3 v v com v dd v ss 0 v input v i(dif) output v o t r(hl) t w(min) 1/f c t r t f time 001aaa063
9397 750 13023 ? koninklijke philips electronics n.v. 2004. all rights reserved. objective data sheet rev. 01 22 april 2004 12 of 21 philips semiconductors tda8939 zero dead time class-d 7.5 a power comparator 13. output power estimation the maximum achievable output power is not only determined by the power comparator characteristics, but by the total system application. the following application blocks determine the maximum achievable output power: power comparator: ? minimum pulse width ? series resistances: r ds_on , bond wires, printed-circuit board tracks, series resistance of the coil, etc. system application: ? power supply voltage ? load impedance ? controller characteristics: maximum modulation depth and carrier frequency. in figure 6 an estimate is given for the output power in full-bridge application as function of the (symmetrical) supply voltage for different values of the load-impedance. the following variables are taken into account: ? minimum pulse width: 150 ns ? total series resistance: 0.4 w ? carrier frequency: 384 khz. (1) z l = 4 w . (2) z l = 6 w . (3) z l = 8 w . (1) z l = 4 w . (2) z l = 6 w . (3) z l = 8 w . fig 6. output power estimation as a function of (symmetrical) supply voltage for thd = 1 %. fig 7. output power estimation as a function of (symmetrical) supply voltage for thd = 10 %. v p (v) 10 30 26 18 22 14 001aaa626 80 120 40 160 200 p out (w) 0 (1) (2) (3) v p (v) 10 30 26 18 22 14 001aaa627 100 150 50 200 250 p out (w) 0 (1) (2) (3)
xxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx x xxxxxxxxxxxxxx xxxxxxxxxx xxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxx xx xxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxx xxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxx xxxxxxxxxxxxxx xxxxxx xx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxx xxxxx x x 9397 750 13023 ? koninklijke philips electronics n.v. 2004. all rights reserved. objective data sheet rev. 01 22 april 2004 13 of 21 philips semiconductors tda8939 zero dead time class-d 7.5 a power comparator 14. application information (1) for 8 w btl and f corner = 40.2 khz: l2 = l3 = 27 m h; c11 = c18 = 470 nf. for 8 w btl and f corner = 44.5 khz: l2 = l3 = 22 m h; c11 = c18 = 470 nf. for 4 w btl and f corner = 47.7 khz: l2 = l3 = 10 m h; c11 = c18 = 1 m f. fig 8. typical application diagram using a single (asymmetrical) supply voltage. 001aaa628 TDA8939TH digital pwm controller r13 in2 pos v ssa1 v ssa2 v ssp1 v ssd v ssp2 47 w cgnd in2 neg r10 diagn 47 w r9 enable 47 w powerup v dda1 v ddp1 v dda2 v ddp2 out1 boot1 out pos con3 output out neg stab1 r7 in1 pos 47 w r5 r2 1 k w r4 10 w r6 10 w (0.25 w) r8 22 w (1 w) c12 220 nf c3 470 m f (63 v) c9 220 pf c10 100 nf c11 (1) l2 (1) l3 (1) c15 100 nf c13 100 nf stab2 boot2 out2 n.c. c14 100 nf v + v + c8 220 pf r3 10 w r1 10 k w in1 neg 9 112 20 24 17 13 16 15 18 19 22 21 8 11 7 6 5 4 2 310 2314 47 w c4 c1 100 nf c2 1000 m f (63 v) 100 nf c5 100 nf c6 100 nf c7 100 nf r11 47 w v cc v + out neg out pos power stage on/off overload r14 10 w (0.25 w) c17 220 pf v + c16 220 pf r12 22 w (1 w) c19 220 nf c18 (1) 1 2 con1 supply v dd + 50 v l1 bead 1 2
9397 750 13023 ? koninklijke philips electronics n.v. 2004. all rights reserved. objective data sheet rev. 01 22 april 2004 14 of 21 philips semiconductors tda8939 zero dead time class-d 7.5 a power comparator 15. test information 15.1 quality information the general quality speci?cation for integrated circuits, snw-fq-611 is applicable.
9397 750 13023 ? koninklijke philips electronics n.v. 2004. all rights reserved. objective data sheet rev. 01 22 april 2004 15 of 21 philips semiconductors tda8939 zero dead time class-d 7.5 a power comparator 16. package outline fig 9. package outline. unit a 4 (1) references outline version european projection issue date 03-02-18 03-07-23 iec jedec jeita mm + 0.08 - 0.04 3.5 0.35 dimensions (mm are the original dimensions) notes 1. limits per individual lead. 2. plastic or metal protrusions of 0.25 mm maximum per side are not included. sot566-3 0 5 10 mm scale hsop24: plastic, heatsink small outline package; 24 leads; low stand-off height sot566-3 a max. detail x a 2 3.5 3.2 d 2 1.1 0.9 h e 14.5 13.9 l p 1.1 0.8 q 1.7 1.5 2.7 2.2 v 0.25 w 0.25 yz 8 0 q 0.07 x 0.03 d 1 13.0 12.6 e 1 6.2 5.8 e 2 2.9 2.5 b p c 0.32 0.23 e 1 d (2) 16.0 15.8 e (2) 11.1 10.9 0.53 0.40 a 3 a 4 a 2 (a 3 ) l p q a q d y x h e e c v m a x a b p w m z d 1 d 2 e 2 e 1 e 24 13 1 12 pin 1 index
9397 750 13023 ? koninklijke philips electronics n.v. 2004. all rights reserved. objective data sheet rev. 01 22 april 2004 16 of 21 philips semiconductors tda8939 zero dead time class-d 7.5 a power comparator 17. soldering 17.1 introduction to soldering surface mount packages this text gives a very brief insight to a complex technology. a more in-depth account of soldering ics can be found in our data handbook ic26; integrated circuit packages (document order number 9398 652 90011). there is no soldering method that is ideal for all surface mount ic packages. wave soldering can still be used for certain surface mount ics, but it is not suitable for ?ne pitch smds. in these situations re?ow soldering is recommended. 17.2 re?ow soldering re?ow soldering requires solder paste (a suspension of ?ne solder particles, ?ux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. several methods exist for re?owing; for example, convection or convection/infrared heating in a conveyor type oven. throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. typical re?ow peak temperatures range from 215 to 270 c depending on solder paste material. the top-surface temperature of the packages should preferably be kept: ? below 225 c (snpb process) or below 245 c (pb-free process) C for all bga, htsson..t and ssop..t packages C for packages with a thickness 3 2.5 mm C for packages with a thickness < 2.5 mm and a volume 3 350 mm 3 so called thick/large packages. ? below 240 c (snpb process) or below 260 c (pb-free process) for packages with a thickness < 2.5 mm and a volume < 350 mm 3 so called small/thin packages. moisture sensitivity precautions, as indicated on packing, must be respected at all times. 17.3 wave soldering conventional single wave soldering is not recommended for surface mount devices (smds) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. to overcome these problems the double-wave soldering method was speci?cally developed. if wave soldering is used the following conditions must be observed for optimal results: ? use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. ? for packages with leads on two sides and a pitch (e): C larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board;
9397 750 13023 ? koninklijke philips electronics n.v. 2004. all rights reserved. objective data sheet rev. 01 22 april 2004 17 of 21 philips semiconductors tda8939 zero dead time class-d 7.5 a power comparator C smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves at the downstream end. ? for packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves downstream and at the side corners. during placement and before soldering, the package must be ?xed with a droplet of adhesive. the adhesive can be applied by screen printing, pin transfer or syringe dispensing. the package can be soldered after the adhesive is cured. typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 c or 265 c, depending on solder material applied, snpb or pb-free respectively. a mildly-activated ?ux will eliminate the need for removal of corrosive residues in most applications. 17.4 manual soldering fix the component by ?rst soldering two diagonally-opposite end leads. use a low voltage (24 v or less) soldering iron applied to the ?at part of the lead. contact time must be limited to 10 seconds at up to 300 c. when using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 c. 17.5 package related soldering information [1] for more detailed information on the bga packages refer to the (lf)bga application note (an01026); order a copy from your philips semiconductors sales of?ce. [2] all surface mount (smd) packages are moisture sensitive. depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). for details, refer to the drypack information in the data handbook ic26; integrated circuit packages; section: packing methods . [3] these transparent plastic packages are extremely sensitive to re?ow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared re?ow soldering with peak temperature exceeding 217 c 10 c measured in the atmosphere of the re?ow oven. the package body peak temperature must be kept as low as possible. table 12: suitability of surface mount ic packages for wave and re?ow soldering methods package [1] soldering method wave re?ow [2] bga, htsson..t [3] , lbga, lfbga, sqfp, ssop..t [3] , tfbga, uson, vfbga not suitable suitable dhvqfn, hbcc, hbga, hlqfp, hso, hsop, hsqfp, hsson, htqfp, htssop, hvqfn, hvson, sms not suitable [4] suitable plcc [5] , so, soj suitable suitable lqfp, qfp, tqfp not recommended [5] [6] suitable ssop, tssop, vso, vssop not recommended [7] suitable cwqccn..l [8] , pmfp [9] , wqccn..l [8] not suitable not suitable
9397 750 13023 ? koninklijke philips electronics n.v. 2004. all rights reserved. objective data sheet rev. 01 22 april 2004 18 of 21 philips semiconductors tda8939 zero dead time class-d 7.5 a power comparator [4] these packages are not suitable for wave soldering. on versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. on versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. [5] if wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. the package footprint must incorporate solder thieves downstream and at the side corners. [6] wave soldering is suitable for lqfp, qfp and tqfp packages with a pitch (e) larger than 0.8 mm; it is de?nitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. [7] wave soldering is suitable for ssop, tssop, vso and vsop packages with a pitch (e) equal to or larger than 0.65 mm; it is de?nitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. [8] image sensor packages in principle should not be soldered. they are mounted in sockets or delivered pre-mounted on ?ex foil. however, the image sensor package can be mounted by the client on a ?ex foil by using a hot bar soldering process. the appropriate soldering pro?le can be provided on request. [9] hot bar soldering or manual soldering is suitable for pmfp packages.
philips semiconductors tda8939 zero dead time class-d 7.5 a power comparator 9397 750 13023 ? koninklijke philips electronics n.v. 2004. all rights reserved. objective data sheet rev. 01 22 april 2004 19 of 21 18. revision history table 13: revision history document id release date data sheet status change notice order number supersedes tda8939_1 20040422 objective data sheet - 9397 750 13023 -
philips semiconductors tda8939 zero dead time class-d 7.5 a power comparator 9397 750 13023 ? koninklijke philips electronics n.v. 2004. all rights reserved. objective data sheet rev. 01 22 april 2004 20 of 21 19. data sheet status [1] please consult the most recently issued data sheet before initiating or completing a design. [2] the product status of the device(s) described in this data sheet may have changed since this data sheet was published. the l atest information is available on the internet at url http://www.semiconductors.philips.com. [3] for data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 20. de?nitions short-form speci?cation the data in a short-form speci?cation is extracted from a full data sheet with the same type number and title. for detailed information see the relevant data sheet or data handbook. limiting values de?nition limiting values given are in accordance with the absolute maximum rating system (iec 60134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the speci?cation is not implied. exposure to limiting values for extended periods may affect device reliability. application information applications that are described herein for any of these products are for illustrative purposes only. philips semiconductors make no representation or warranty that such applications will be suitable for the speci?ed use without further testing or modi?cation. 21. disclaimers life support these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips semiconductors for any damages resulting from such application. right to make changes philips semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. when the product is in full production (status production), relevant changes will be communicated via a customer product/process change noti?cation (cpcn). philips semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise speci?ed. 22. contact information for additional information, please visit: http://www.semiconductors.philips.com for sales of?ce addresses, send an email to: sales.addresses@www.semiconductors.philips.com level data sheet status [1] product status [2] [3] de?nition i objective data development this data sheet contains data from the objective speci?cation for product development. philips semiconductors reserves the right to change the speci?cation in any manner without notice. ii preliminary data quali?cation this data sheet contains data from the preliminary speci?cation. supplementary data will be published at a later date. philips semiconductors reserves the right to change the speci?cation without notice, in order to improve the design and supply the best possible product. iii product data production this data sheet contains data from the product speci?cation. philips semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. relevant changes will be communicated via a customer product/process change noti?cation (cpcn).
? koninklijke philips electronics n.v. 2004 all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. date of release: 22 april 2004 document order number: 9397 750 13023 published in the netherlands philips semiconductors tda8939 zero dead time class-d 7.5 a power comparator 23. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 quick reference data . . . . . . . . . . . . . . . . . . . . . 2 5 ordering information . . . . . . . . . . . . . . . . . . . . . 2 6 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 pinning information . . . . . . . . . . . . . . . . . . . . . . 4 7.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 functional description . . . . . . . . . . . . . . . . . . . 5 8.1 general . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 8.2 protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 8.3 interfacing between controller and the tda8939 . 6 8.3.1 inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 8.3.2 outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 8.3.3 reference voltages . . . . . . . . . . . . . . . . . . . . . . 7 8.4 start-up timing . . . . . . . . . . . . . . . . . . . . . . . . . 7 9 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 8 10 thermal characteristics. . . . . . . . . . . . . . . . . . . 8 11 static characteristics. . . . . . . . . . . . . . . . . . . . . 9 12 dynamic characteristics . . . . . . . . . . . . . . . . . 10 13 output power estimation. . . . . . . . . . . . . . . . . 12 14 application information. . . . . . . . . . . . . . . . . . 13 15 test information . . . . . . . . . . . . . . . . . . . . . . . . 14 15.1 quality information . . . . . . . . . . . . . . . . . . . . . 14 16 package outline . . . . . . . . . . . . . . . . . . . . . . . . 15 17 soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 17.1 introduction to soldering surface mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 17.2 re?ow soldering . . . . . . . . . . . . . . . . . . . . . . . 16 17.3 wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 16 17.4 manual soldering . . . . . . . . . . . . . . . . . . . . . . 17 17.5 package related soldering information . . . . . . 17 18 revision history . . . . . . . . . . . . . . . . . . . . . . . . 19 19 data sheet status . . . . . . . . . . . . . . . . . . . . . . . 20 20 de?nitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 21 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 22 contact information . . . . . . . . . . . . . . . . . . . . 20

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